Manager Hong-Chen Cheng, who has been working on static random access memory for 19 years, has developed a number of inventive memory technologies, creating major development and reform in process miniaturization and helping the company achieve the leading position in the industry. He led the team to develop 16 nm automotive certified memory IP(intellectual property) and expand the field of semiconductor foundry vehicle electronics. He provided customized memory intellectual property core on TSMC Open Innovation Platform® (OIP), and achieved first-time silicon success in high performance computing, mobile, automotive and IoT products with good yield. And through TSMC Open Innovation Platform® (OIP), he provides most comprehensive and robust silicon-proven memory IP and library portfolio, and bring together the customers and partners under robust design ecosystem, technologies and manufacturing excellence.
Innovative Elite Award (Youth Group) of the 6 NATIONAL INDUSTRIAL INNOVATION AWARD.
With technology scaled to physical limit, Design and Technology co-optimization is more and more important keeping PPA trend scales in more than Moore era.
An introduction of design platform in TSMC covers process design kits, foundation IPs, layout, design flow and silicon verification.